Feng Z, Li L, Xinxin L. Heat dissipation apparatus and communications device
U.S. Patent 10,804,783[P]. 2020-10-13.
Abstract
Embodiments of the present invention provide a heat dissipation apparatus. Wherein a loop coil is disposed on a swing plate. A first magnet and a second magnet are located on two sides of the loop coil, and when a current whose direction periodically varies flows through the loop coil, an Ampere force whose direction periodically varies is applied to the loop coil under an action of a magnetic field formed by the first magnet and the second magnet, so that the loop coil drives the swing plate to swing back and forth. The present invention is used for heat dissipation of a micro electronic component.
Link:https://patents.google.com/patent/US10804783B2/en
